Ewch i’r prif gynnwys

Dadansoddiad Sbectrosgopeg Ffoto-electron Pelydr-x (XPS)

Mae'r cynnwys hwn ar gael yn Saesneg yn unig.

Combining the next generation of photoelectron detector, our spectrometer incorporates quantitative, real time parallel imaging with the highest resolution spectroscopy over all analysis areas.

XPS surface analysis facility
Our Kratos Axis Ultra-DLD XPS System

XPS is the most widely used surface analysis technique, providing information about surface layers or thin film structures.

Because of its relative simplicity in use and in interpreting data, the information XPS provides value in many industrial applications including:

  • polymer surface modification
  • catalysis
  • ceramics, corrosion, adhesion
  • semiconductor materials
  • packaging, magnetic media, thin film coatings
  • medical implants, bio-materials, teeth and bones.

Technical features

This system integrates the Kratos magnetic immersion lens and charge neutralisation system with dual analysers (spherical mirror and concentric hemispherical analysers). Together with the delay-line detector (DLD) in both imaging and spectroscopy modes, the system provides exceptional results. Features include:

  • high energy resolution
  • multi-point spectroscopy
  • fast parallel imaging
  • ion scattering spectroscopy (ISS)
  • depth profiling
  • sample treatment cell
  • low energy electron diffraction (LEED)
  • metal deposition sources
  • quartz microbalance & temperature programmed desorption (TPD).

How it's helped

We applied XPS to investigate the unexpected discolouration of a polymer film widely used in industry. Using XPS on the polymer coatings together with analysis of the film precursor materials, it was found that a batch of the precursor was contaminated with a halogen, which in small concentrations gave a blue tint to the material without affecting performance.

We were approached to analyse intermittent contact on tracks of PCBs used in forestry applications. Comparing PCBs at each stage of manufacture, together with a selection of those used in the field, we were able to determine via XPS that a silicon containing product was building up on the major contact points. Through changing solvents used in the material production, this problem was soon alleviated.