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Our state-of-the-art equipment and modern facilities enable researchers and industry to work together.

The ICS moved to its new cleanroom in 2023. This purpose built 1500m2 facility enabled the scale-up to 200mm (8”) wafer capacity, critical for industrial relevance. With support from both the EPSRC and the Welsh Government via European Regional Development Funds, the ICS has invested in new tooling to provide a wide range of processing options. This ensures we can deliver a flexible service to meet the widest possible range of fabrication demands in terms of materials, geometries and scale from small pieces to 200mm wafers.

Equipment includes:

  • Lesker PRO Line™ PVD 200™ THIN FILM DEPOSITION SYSTEM with UHV loadlock
  • Buhler Boxer Dielecric Evaporator
  • Moorfield Minilab ET080A e-beam
  • Moorfield Minilab S060M
  • AET Wet Oxidation (AlOx) Furnace
  • Oxford Instruments PlasmaPro 100 Cobra 300 Plasma Etch Tool
  • Oxford Instruments RIE80
  • Jipelec JetFirst 300 RTP processor
  • Jipelec JetFirst 100 RTP processor
  • Plasma Etch Inc. PE-100 Plasma Asher
  • SÜSS MicroTec MJB4 Mask Aligner
  • SÜSS MicroTec MA6 Mask Aligner
  • SÜSS MicroTec MA8 Gen4 Mask Aligner
  • SÜSS MicroTec HMx9 Mask Cleaner
  • SÜSS MicroTec MCS8 Labcluster
  • SÜSS MicroTec AD12 Aqueous Developer
  • SÜSS MicroTec SD12 Solvent Developer
  • Beneq TFS 200 Atomic Layer Deposition (ALD) System
  • Heidelberg MLA150
  • Raith EBPG 5200 (Summer 2023!)
  • Raith Eline 100mm Ebeam writer
  • Durham Magneto Optics, ML3
  • Hitachi SU8320 High Resolution SEM
  • Thermo Fisher PhenomXL G2 SEM
  • Bruker DektakXT Advanced System (DXT-A)
  • Semilab SE-2000 Ellipsometer
  • Zeiss Z2 Vario Axio imager microscope
  • Keyence VHX-7100 microscope
  • Loadpoint nanoace wafer dicing system
  • KLA P17 Stylus Profilometer
  • Surfscan 6200
  • Royce Instruments DE35i-8 semi-automatic Die Pick and Place system
  • Logitech DL61 Lapping machine
  • DTX Scribe & break system


For more information about our facilities, please contact: