Chemical Mechanical Planarization system
Chemical Mechanical Planarization system for polishing diamond etc, wafers up to 4".
| Brand/model | Logitech CMP Tribo |
|---|---|
| Manylion | Chemical Mechanical Planarization system for polishing diamond etc, wafers up to 4". |
| Ysgol | Yr Ysgol Ffiseg a Seryddiaeth |
Cysylltwch
Professor Oliver Williams
- williamso@cardiff.ac.uk
- +44 (0)29 2087 4978
Lleoliad
Queen's Buildings
5 The Parade
Heol Casnewydd
CF24 3AA
5 The Parade
Heol Casnewydd
CF24 3AA